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Presentation to highlight recent developments in Aerosol Jet technology
March 9, 2010
By: DAVID SAVASTANO
Editor, Ink World Magazine
Optomec announced that Mike O’Reilly, Optomec’s Aerosol Jet product manager, will give a presentation on Aerosol Jet Deposition Technology for High Density, 3-D Interconnects for Multi-Chip Packaging at the IMAPS Device Packaging Conference on March 11, 2010. The conference will be held from March 9-11 at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, AZ. Optomec and Vertcial Circuits Inc. have partnered together in developing a complete solution which addresses ...
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